Journal
MICROELECTRONIC ENGINEERING
Volume 86, Issue 10, Pages 1983-1988Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2008.12.068
Keywords
Ultraviolet imprint process; Hard stamp; Vacuum environment; Auto release
Categories
Funding
- Center for Nanoscale Mechatronics and Manufacturing [08K1401-00210]
- Korean Ministry of Education, Science, and Technology
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We propose a very large-area ultraviolet imprint lithography process as a promising alternative to expensive conventional optical lithography for the production of display panels. This process uses a large-area hard stamp in a low vacuum environment. The hard quartz stamp is used to achieve high overlay accuracy, and the vacuum environment is required to ensure that air bubble defects do not occur during imprinting. We demonstrate that the quartz stamp with microscale patterns can be used for imprinting 18-in. diagonal substrates via single-step UV imprint in a low vacuum environment to obtain a practical residual layer thickness (RLT) for micro pattern transfer to the substrate. Numerical analysis is performed to clarify the physical phenomena underlying imprint process. (C) 2009 Elsevier B.V. All rights reserved.
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