Journal
MECHANICS RESEARCH COMMUNICATIONS
Volume 43, Issue -, Pages 46-49Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.mechrescom.2012.02.011
Keywords
Adhesion; Shear; Transfer printing; Interfacial delamination
Categories
Funding
- NSF [CMMI-0749028, ECCS-0824129, OISE-1043143, CMMI-0845294]
- DOE, Division of Materials Sciences Grant [DE-FG02-07ER46453]
- AFOSR-MURI [FA9550-08-1-0337]
- Directorate For Engineering
- Div Of Civil, Mechanical, & Manufact Inn [0845294] Funding Source: National Science Foundation
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [824129] Funding Source: National Science Foundation
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Transfer printing is an important technique for assembling micro/nanomaterials on unusual substrates, with promising applications in the fabrication of stretchable and flexible electronics designed for use in areas such as biomedicine. The process involves retrieval of structures (e.g., micro-devices) from their growth (donor) substrate via an elastomeric stamp (i.e.. an element with posts on its surface), and then delivers them onto a different (receiver) substrate. An analytical mechanics model is developed to identify the key parameters for a shear-enhanced mode for transfer printing. The results predict that the pull-off force decreases linearly with increasing shear strain in the post, or with shear displacement across the stamp. This prediction agrees well with the experiments. Published by Elsevier Ltd.
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