Journal
MEASUREMENT
Volume 49, Issue -, Pages 283-288Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.measurement.2013.12.006
Keywords
Thin epoxy film; DIC sensor; MDIC method; Mechanical behavior
Funding
- National Basic Research Program of China (973 Project) [2010CB631005, 2011CB606105]
- National Natural Science Foundation of China [11232008, 91216301, 11227801, 11172151]
- Tsinghua University Initiative Scientific Research Program
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The thin epoxy film with micro-scale speckle pattern as a digital image correlation (DIC) deformation sensor has been fabricated or transferred on the surface of sample in the previous study. When the thickness of the film cannot be ignored, it may have an influence on the validity of measurement results. And thus, the influence of the thin epoxy film on mechanical properties of substrates should be investigated. In this study, the mechanical behavior of thin film itself and surface strain of composite structure of thin film and substrate were measured using micro digital image correlation (MDIC) method. And theoretical and simulative results were also analyzed. From the comparison analysis of theoretical, simulative and experimental results, it is concluded that when the ratios of Young's modulus and thickness between the film and substrate are smaller than 13 and 0.5 respectively, the influence from the thin film can be ignored, and thin epoxy film as DIC sensor can be used to measure the deformation of substrate. (C) 2013 Elsevier Ltd. All rights reserved.
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