Journal
MATERIALS TODAY
Volume 17, Issue 4, Pages 163-174Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.mattod.2014.04.003
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Funding
- U.S. National Science Foundation (NSF) Thermal Transport Processes program [CBET-1336968]
- NSF Nanosystems Engineering Research Center: Nanomanufacturing Systems for Mobile Computing and Energy Technologies [EEC-1160494]
- Department of Energy Office of Basic Energy Science [DE-FG02-07ER46377]
- Office of Naval Research [N00014-14-1-0258]
- Directorate For Engineering
- Div Of Chem, Bioeng, Env, & Transp Sys [1336968] Funding Source: National Science Foundation
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The rapid development of faster, cheaper, and more powerful computing has led to some of the most important technological and societal advances in modern history. However, the physical means associated with enhancing computing capabilities at the device and die levels have also created a very challenging set of circumstances for keeping electronic devices cool, a critical factor in determining their speed, efficiency, and reliability. With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials to help address some of these pressing thermal management challenges. In this paper a number of cubic crystals, two-dimensional layered materials, nanostructure networks and composites, molecular layers and surface functionalization, and aligned polymer structures are examined for potential applications as heat spreading layers and substrates, thermal interface materials, and underfill materials in future-generation electronics.
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