Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 737, Issue -, Pages 336-340Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2018.09.069
Keywords
Cu; In situ TEM; Twinning; Cracking; Molecular dynamics simulations
Categories
Funding
- National Natural Science Foundation of China [51071125, 51271147, 51201134, 51201135]
- 111 Project of China [B08040]
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A twinning-induced void initiation mechanism at grain boundary is revealed in Cu through in situ tensile tests. Two microcracks connected by a twin boundary (TB) are formed following the growth of the void, which then develop via the relative sliding of the two crystals beside the migrating TB. The experimental observations of TB migration and dislocation activities are corroborated by performing molecular dynamics simulations.
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