Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 562, Issue -, Pages 25-32Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2012.10.079
Keywords
Graphene nanosheets (GNSs); Lead-free solder; Thermal expansion; Mechanical properties
Categories
Funding
- Key Project in the Science & Technology Pillar Program of Tianjin [11ZCKFGX03000]
- National Natural Science Foundation of China [50975196, 51205282, 51275341]
- Program for New Century Excellent Talents in University (NCET)
- Specialized Research Fund for the Doctoral Program of Higher Education of China [20110032130002]
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Varying weight fractions of graphene nanosheets were successfully incorporated into lead-free solder using the powder metallurgy route. The effects of graphene nanosheets on the physical, thermal, and mechanical properties of a Sn-Ag-Cu solder alloy were investigated. With the increasing addition of graphene nanosheets, the nanocomposite solders showed a corresponding improvement in their wetting property but an insignificant change in their melting point. The thermomechanical analysis showed that the presence of graphene nanosheets can effectively decrease the coefficient of thermal expansion (CTE) of the nanocomposites. Furthermore, an improvement in UTS and a decrease in ductility were recorded with the addition of graphene nanosheets. The reinforcing mechanism of the graphene nanosheets on various properties obtained was also analyzed in this study. (C) 2012 Elsevier B.V. All rights reserved.
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