Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 528, Issue 22-23, Pages 7103-7106Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2011.05.077
Keywords
Intermetallic alloys and compounds; Copper-clad aluminium; Mechanical properties; Deformation and fracture; Annealing processes; Diffusion; Drawing
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Heat treatments performed on copper-clad aluminium thin wires increase the ductility of copper and aluminium but activate diffusion between both layers, creating brittle intermetallic compounds. Ductility reaches a maximum for an optimal intermetallic thickness related to appropriate annealing conditions in order to avoid Kirkendall void formation assisted by stress gradients. (C) 2011 Elsevier B.V. All rights reserved.
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