Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 527, Issue 20, Pages 5212-5219Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2010.04.078
Keywords
Lead-free solder; Sn-Zn alloy; Microstructure; Mechanical properties
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In the present study, the effects of separate and dual addition of small amount of Ag and Cu on the microstructure and mechanical properties of the eutectic Sn-9Zn solder alloy were investigated. Results indicate that alloying of Ag and/or Cu resulted in refine the coarse needle-like Zn-rich phase and formation of intermetallic compounds (IMCs) with the eutectic solder. Single addition of Ag led to formation of AgZn, Ag5Zn8 and epsilon-AgZn3 IMCs, which results in significant increase in both ultimate tensile strength CUTS) and ductility, while, the flower shaped and rod shaped Cu6Sn5, gamma-Cu5Zn8 and epsilon-CuZn5 IMCs produced by Cu alloying, results in small increase in UTS and ductility. The dual addition of Ag and Cu suppressed the appearance of Ag5Zn8 IMCs due to the competition for Zn between Cu and Ag, which results in slight decrease in UTS and ductility of Sn-9Zn-1.5Ag solder. Worthy of notice is that all alloys demonstrated an increase in both UTS and yield stress with increasing strain rate and/or decreasing testing temperature, indicating that the tensile behavior of the four alloys often exhibits a strain rate and temperature dependence. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved.
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