Preparation and properties of enhanced bulk nanoporous coppers

The preparation and electrical, thermal and mechanical properties of enhanced bulk nanoporous coppers were investigated. Bulk nanoporous coppers with channel size of 210 +/- 30 nm and ligament width of 120 +/- 30 nm were firstly prepared by dealloying of Cu30Zn70 precursor alloys. The enhancement was then realized by electroless plating involved Cu deposition. The enhanced bulk nanoporous coppers exhibit a three-dimensional bicontinuous porous structure with channel and ligament size of 150 +/- 30 nm. After the electroless plating process, the thermal diffusivity of bulk nanoporous coppers was increased slightly. What is more, their mechanical and electrical properties were improved. The indentation hardness was increased to 90 +/- 28 MPa and the electrical resistivity was decreased three times. (C) 2012 Elsevier B.V. All rights reserved.