4.6 Article

A new palladium-free surface activation process for Ni electroless plating on ABS plastic

Journal

MATERIALS LETTERS
Volume 63, Issue 11, Pages 840-842

Publisher

ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2009.01.006

Keywords

Palladium-free; Surface activation; Nanoparticle; Nickel deposition; XPS; SEM; XRD

Funding

  1. Tianjin municipal science and technology committee [05YFSYSF030]

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A novel palladium-free and environmentally friendly surface activation process for Ni electroless plating was studied. The activation was carried out by immobilizing Ni nanoparticles as catalyst site on the ABS plastic surface. It is a cost effective activation method since Ni nanoparticles were successfully used as catalyst. The surface of ABS foils after etching and activating was investigated by XPS to get more information about the interfacial reaction mechanisms. Ni nanoparticles were uniformly formed on the substrate and a glossy and smooth Ni-P plating layer was obtained according to the SEM photographs. XRD pattern showed that the Ni-P layer is amorphous. (C) 2009 Elsevier B.V. All rights reserved.

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