Electrochemical behavior of low phosphorus electroless Ni-P-Si3N4 composite coatings

In the present investigation the electroless Ni-P-Si3N4 composite coatings were prepared by using a low phosphorus bath containing submicron size silicon nitride particles. Plain Ni-P deposits were also prepared for comparison. The phosphorus contents present in electroless plain Ni-P and Ni-P-Si3N4 coatings are 3.7 and 3.4 wt.%, respectively. Scanning electron microscope (SEM) images obtained for composite coatings (cross-sections) showed that the second phase particles are uniformly distributed throughout the thickness of the deposits. It was found that nodularity increased with particle codeposition in Ni-P matrix. To find out the electrochemical behavior of plain Ni-P and composite coatings, potentiodynamic polarization and electrochemical impedance (EIS) studies were carried out in 3.5 wt.% sodium chloride solution in non-deaerated condition. Second phase particle incorporation in Ni-P matrix indicated a marginal decrease in corrosion current density compared to the plain Ni-P deposits. This was further confirmed by EIS studies and SEM analysis of the corroded samples. (C) 2009 Elsevier B.V. All rights reserved.