Journal
MATERIALS CHARACTERIZATION
Volume 86, Issue -, Pages 212-220Publisher
ELSEVIER SCIENCE INC
DOI: 10.1016/j.matchar.2013.10.013
Keywords
Diffusion bonding; Inter layer; Tungsten; Steel; Electron probe microanalysis
Categories
Funding
- National Natural Science Foundation of China [50774098]
- National 863 Plan Project of China
- Program for Chang Jiang Scholars in University of Ministry of Education of China
Ask authors/readers for more resources
Diffusion bonding between W and steel using V/Ni composite interlayer was carried out in vacuum at 1050 degrees C and 10 MPa for 1 h. The microstructural examination and mechanical property evaluation of the joints show that the bonding of W to steel was successful. No intermetallic compound was observed at the steel/Ni and V/W interfaces for the joints bonded. The electron probe microanalysis and X-ray diffraction analysis revealed that Ni3V, Ni2V, Ni2V3 and NiV3 were formed at the Ni/V interface. The tensile strength of about 362 MPa was obtained for as-bonded W/steel joint and the failure occurred at W near the V/W interface. The nano-indentation test across the joining interfaces demonstrated the effect of solid solution strengthening and intermetallic compound formation in the diffusion zone. (C) 2013 Elsevier Inc. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available