Journal
MATERIALS CHARACTERIZATION
Volume 68, Issue -, Pages 82-87Publisher
ELSEVIER SCIENCE INC
DOI: 10.1016/j.matchar.2012.03.016
Keywords
Diffusion bonding; Titanium; Stainless steel; Interfacial microstructure; Tensile strength
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Funding
- National Natural Science Foundation of China [51071123]
- State Key Laboratory of Solidification Processing in Northwestern Polytechnical University, China [43-QP-2009, 31-TP-2009]
- 111 Project [B08040]
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By using Nb/Cu/Ni structure as multi-interlayer, diffusion bonding titanium to austenitic stainless steel has been conducted. The effects of bonding temperature and bonding time on the interfacial microstructure were analyzed by scanning electron microscope equipped with energy dispersive spectroscope, and the joint strength was evaluated by tensile test. The results showed that Ni atoms aggregated at the Cu-Nb interface, which promoted Cu solution in Nb. This phenomenon forms a Cu-Nb solution strengthening effect. However, such effect would decay by using long bonding time that dilutes Ni atom aggregation, or be suppressed by using high bonding temperature that embrittles the Cu-Nb interface due to the formation of large grown intermetallic compounds. The sound joint was obtained by promoted parameters as 850 degrees C for 30-45 min, under which a bonding strength around 300 MPa could be obtained. (C) 2012 Elsevier Inc. All rights reserved.
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