Journal
MATERIALS & DESIGN
Volume 57, Issue -, Pages 646-651Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2013.12.076
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Funding
- Natural Science Foundation of Jiangsu Province [BK2012144]
- Natural Science Foundation of the Higher Education Institutions of Jiangsu Province [12KJB460005]
- Jiangsu Normal University Foundation [11XLR16]
- Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation [JSAWS-11-03]
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In order to enhance the properties of SnAgCu lead-free solders in microelectronic packaging, various contents of rare earth Yb were incorporated into the alloys. Results indicated that the addition of Yb can improve the wettability, tensile strength, thermal fatigue behavior of lead-free alloys. The lead-free solder with 0.05% Yb addition exhibited the best comprehensive properties as compared to the alloys with other Yb weight fractions. And found that after soldering, the initial interfacial IMC thickness of SnAg-CuYb solder joint was smaller than that of SnAgCu solder joints, and this signified that the addition of Yb was effective in retarding the growth of the IMC layer. In addition, the Yb can refine the microstructures of SnAgCu solder, excessive Yb added can form bulk Sn-Yb phase and deteriorate the properties. (C) 2014 Elsevier Ltd. All rights reserved.
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