Journal
MATERIALS & DESIGN
Volume 44, Issue -, Pages 149-154Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2012.07.024
Keywords
Laser shock processing; Fatigue behavior; Residual stress; Crack growth analysis
Categories
Funding
- National Natural Science Foundation of China [50905080]
- China Postdoctoral Science Foundation [20100471385]
- Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD)
Ask authors/readers for more resources
Laser shock processing (LSP) is used to enhance the fatigue behavior of the structures. The effects of residual stress on fatigue behavior and crack propagation from LSP-worked hole were performed in this investigation. The influence of compressive stress on fatigue behavior and crack propagation of the hole was revealed, and a parametric study on residual stress and stress intensity factor was performed in order to determine their effect on crack growth propagation. The dislocation microstructure of 7050 aluminum at different laser intensities shows similar results, which indicated that LSP had an obvious inhibitory action to fatigue crack initiation and growth of the hole crack. (C) 2012 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available