Journal
MATERIALS & DESIGN
Volume 37, Issue -, Pages 313-316Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2012.01.023
Keywords
-
Categories
Ask authors/readers for more resources
A356/45vol.% SiCp composites with a uniform distribution of SiC particles have been fabricated by a liquid pressing method. Increasing the melt temperature, holding time and pre-treatment of SiCp by thermal oxidation improves the soundness of composites for the liquid pressing method. The sound composites exhibited low coefficient of thermal expansion (8 ppm/K) and high thermal conductivity (155 W/m K). The measured values for coefficient of thermal expansion agree well with the predicted values based on Turner's model irrespective of porosity. The measured values for thermal conductivity decrease with porosity, and the effect of pore on the thermal conductivity has been evaluated based on the modified Hasselman-Johnson model. (C) 2012 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available