Journal
MATERIALS & DESIGN
Volume 34, Issue -, Pages 483-487Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2011.07.029
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The pure copper sample was severely plastically deformed by 8-pass equal channel angular rolling process. The thermal stability of processed copper was investigated by measuring the development of microhardness at isochronal annealing temperature. According to variation in microhardness, the recrystallization temperature of pure copper after 8 pass of equal channel angular rolling process was 230 degrees C. The influence of post-annealing on microstructure, mechanical and electrical properties of the 8-pass processed copper was investigated. Scanning electron microscopy micrographs and X-ray diffraction peak broadening analysis have demonstrated that grain size decreased with post-annealing, which is the reason for the increase in strength of the copper specimen. The electrical conductivity of sample increased after post-annealing because of the rearrangement of dislocations. Crown Copyright (C) 2011 Published by Elsevier Ltd. All rights reserved.
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