Journal
MATERIALS & DESIGN
Volume 39, Issue -, Pages 87-92Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2012.02.029
Keywords
Composites: metal matrix; Casting; Thermal
Categories
Funding
- Ministry of Education of China [707007]
- Beijing Municipal Commission of Education of China [2008100071601Y]
- Program for New Century Excellent Talents in University [NCET-10-0227]
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Al-Cu matrix composites reinforced with diamond particles (Al-Cu/diamond composites) have been produced by a squeeze casting method. Cu content added to Al matrix was varied from 0 to 3.0 wt.% to detect the effect on thermal conductivity and thermal expansion behavior of the resultant Al-Cu/diamond composites. The measured thermal conductivity for the Al-Cu/diamond composites increased from 210 to 330 W/m/K with increasing Cu content from 0 to 3.0 wt.%. Accordingly, the coefficient of thermal expansion (CTE) was tailored from 13 x 10 (6) to 6 x 10 (6)/K, which is compatible with the CTE of semiconductors in electronic packaging applications. The enhanced thermal conductivity and reduced coefficient of thermal expansion were ascribed to strong interface bonding in the Al-Cu/diamond composites. Cu addition has lowered the melting point and resulted in the formation of Al2Cu phase in Al matrix. This is the underlying mechanism responsible for the strengthening of Al-Cu/diamond interface. The results show that Cu alloying is an effective approach to promoting interface bonding between Al and diamond. (C) 2012 Elsevier Ltd. All rights reserved.
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