Warpage and structural analysis of thin shell plastic in the plastic injection molding

In this study, the cell thin shell phone cover produced with polycarbonate/acrylonitrile butadiene styrene (PC/ABS) thermoplastic were decided as a model. First, the effects of the injection parameters on warpage for different thickness values were examined using Taguchi method. The warpage values were found by analyses which were done by moldflow plastic insight (MPI) 4.0 software. The most influential parameter on the warpage of PC/ABS material was found as packing pressure. Second, to determine the forces that cause the plastic part to fail at the points determined over the top surface of the cell phone cover, CATIA V5R12 (general structural analysis) was used. The structural analysis of ABS, PC, reinforced ABS, reinforced PC/ABS thermoplastic materials in addition to PC/ABS material used in telephone manufacture were done in order to determine the performance. When we look at the structural analysis, the strongest materials are 15% carbon fiber reinforced PC/ABS, 15% carbon fiber reinforced ABS, PC, PC/ABS and ABS, respectively. The most critical point on the top surface of the cell phone is point 2 (C) 2008 Elsevier Ltd. All rights reserved.