III-V/silicon photonics for on-chip and inter-chip optical interconnects

In this paper III-V on silicon-on-insulator (SOI) heterogeneous integration is reviewed for the realization of near infrared light sources on a silicon waveguide platform, suitable for inter-chip and intra-chip optical interconnects. Two bonding technologies are used to realize the III-V/SOI integration: one based on molecular wafer bonding and the other based on DVS-BCB adhesive wafer bonding. The realization of micro-disk lasers. Fabry-Perot lasers, DFB lasers, DBR laser and mode locked lasers on the III-V/SOI material platform is discussed Artist impression of a multi-wavelength laser based on micro-disk cavities realized on a III-V/SOI heterogeneous platform and a microscope image of a realized structure. (C) 2010 by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim