Journal
LANGMUIR
Volume 25, Issue 1, Pages 429-433Publisher
AMER CHEMICAL SOC
DOI: 10.1021/la802182y
Keywords
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Funding
- Korea Science and Engineering Foundation (KOSEF)
- Ministry of Education, Science and Technology [R0A-2005-000-10011-0]
- Korea Institute of Industrial Technology(KITECH) [10016738] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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We have developed a Cu-Ag-based mixed metal conductive ink from which highly conductive tracks form on a flexible substrate after annealing at low temperature. Addition of small Ag particles significantly improves the particle packing density by filling the interstices formed between the larger Cu particles, which in turn facilitates better conductivity compared to pure Cu metal film. The particle size and volume ratio of the Ag particles added should be carefully controlled to achieve maximum packing density in the bimodal particle system, which is consistent with the theoretical considerations of the Furnas model. In addition, we demonstrate direct writing of complex patterns that exhibit high conductivity upon annealing at sufficiently low temperature (175-210 degrees C) to not damage the transparent plastic substrate such as polyethersulphone (PES).
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