Journal
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
Volume 27, Issue 2, Pages 581-584Publisher
A V S AMER INST PHYSICS
DOI: 10.1116/1.3086721
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Funding
- United States Department of Energy's National Nuclear Security Administration [DE-AC04-94AL85000]
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The authors have developed a treatment process to improve the etch resistance of,in electron beam lithography resist (ZEP 520A) to allow direct pattern transfer from the resist into a hard mask using plasma etching without a metal lift-off process. When heated to 90 degrees C and exposed for 17 min to a dose of approximately 8 mW/cm(2) at 248 nm, changes occur in the resist that are observable using infrared spectroscopy. These changes increase the etch resistance of ZEP 520A to a CF4/O-2 plasma. This article will document the observed changes in the improved etch resistance of the ZEP 520A electron beam resist. 2009 American Vacuum Society. [DOI: 10.1116/1.3086721]
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