Thermal Analysis of a Phase Change Material Based Heat Sink for Cooling Protruding Electronic Chips

This work aims to numerically study the melting natural convection in a rectangular enclosure heated by three discreet protruding electronic chips. The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated to a phase change material (PCM, n-eicosane with melting temperature, Tm = 36 degrees C). Numerical investigations were carried out in order to examine the effects of the plate thickness on the maximum temperature of electronic components, the percentage contribution of plate heat conduction on the total removed heat and temperature profiles in the plate. Correlations for the dimensionless secured working time (time to reach the threshold temperature, Tcr = 75 degrees C) and the corresponding liquid fraction were derived.