Related references
Note: Only part of the references are listed.High Performance Miscible Polyetherimide/Bismaleimide Resins with Simultaneously Improved Integrated Properties Based on a Novel Hyperbranched Polysiloxane Having a High Degree of Branching
Bin Sun et al.
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH (2013)
Flame retardancy and thermal degradation mechanism of epoxy resin composites based on a DOPO substituted organophosphorus oligomer
Xin Wang et al.
POLYMER (2010)
Synthesis, preparation and properties of novel high-performance allyl-maleimide resins
Haoyu Tang et al.
POLYMER (2009)
Templated silica tubes with high aspect ratios as effective fillers for enhancing the overall performance of polyimide films
Shao-Yun Fu et al.
CHEMISTRY OF MATERIALS (2008)
Thermal properties and toughness performance of hyperbranched-polyimide-modified epoxy resins
Fan-Long Jin et al.
JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS (2006)
Preparation and characterization of hyperbranched polymer/silica hybrid nanocoatings by dual-curing process
Ezio Amerio et al.
MACROMOLECULAR MATERIALS AND ENGINEERING (2006)
Evaluation and identification of electrical and thermal conduction mechanisms in carbon nanotube/epoxy composites
FH Gojny et al.
POLYMER (2006)
Kinetic analysis of organosilane hydrolysis and condensation
SA Torry et al.
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2006)
Thermal degradation behaviour and kinetic analysis of epoxy/montmorillonite nanocomposites
AJ Gu et al.
POLYMER DEGRADATION AND STABILITY (2003)
Epoxy nanocomposites with high mechanical and tribological performance
B Wetzel et al.
COMPOSITES SCIENCE AND TECHNOLOGY (2003)
Lanthanide complex/polymer composite optical resin with intense narrow band emission, high transparency and good mechanical performance
DM Wang et al.
JOURNAL OF MATERIALS CHEMISTRY (2003)
Epoxy resins possessing flame retardant elements from silicon incorporated epoxy compounds cured with phosphorus or nitrogen containing curing agents
CS Wu et al.
POLYMER (2002)
Cure kinetics of epoxy resins studied by non-isothermal DSC data
D Rosu et al.
THERMOCHIMICA ACTA (2002)
Characterization and properties of new silicone-containing epoxy resin
WJ Wang et al.
POLYMER (2000)
Share Paper
