Journal
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
Volume 31, Issue 9, Pages 1631-1639Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.jeurceramsoc.2011.03.034
Keywords
Laser microprocessing; Electron microscopy; Corrosion; Al2O3; Structural applications
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Funding
- National 863 Hi-Tech Research and Development Program of China [2007AA030113]
- National Natural Science Foundation of China [51005083]
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In this study, an Nd:YVO4 UV laser was used for microprocessing ultrathin (125 mu m) ceramic plates for use as a multi-layer microchip substrate. The effects of the UV laser microprocessing parameters, including laser power density, frequency, laser scanning speed, and pass delay on microprocessing accuracy and quality (kerf width and arithmetic average roughness R-a on the kerf sidewall) were investigated by means of a 4 x 4 orthogonal design. The key processing parameters were determined and optimized for small kerf width and minimal R-a of the kerf sidewall while retaining high production efficiency. Subsequent chemical etching of the laser processed areas was performed to reduce the kerf surface and kerf sidewall roughness by removing debris and the thin recast layer for the required size precision and post gilding treatment. The results showed that a clean surface and crack-free kerf sidewall with roughness R-a of 0.16 mu m could be achieved by laser microprocessing and chemical etching. (C) 2011 Elsevier Ltd. All rights reserved.
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