Related references
Note: Only part of the references are listed.Do all ionic liquids need organic cations? Characterisation of [AlCl2 center dot nAmide](+) AlCl4- and comparison with imidazolium based systems
Hadi M. A. Abood et al.
CHEMICAL COMMUNICATIONS (2011)
Copper(I)-Containing Ionic Liquids for High-Rate Electrodeposition
Neil R. Brooks et al.
CHEMISTRY-A EUROPEAN JOURNAL (2011)
Properties of ionic liquids containing silver(I) or protic alkylethylenediamine cations with a bis(trifluoromethanesulfonyl)amide anion
Masayasu Iida et al.
JOURNAL OF COLLOID AND INTERFACE SCIENCE (2011)
Electrodeposition from Cationic Cuprous Organic Complexes: Ionic Liquids for High Current Density Electroplating
Stijn Schaltin et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2011)
Seedless Copper Electrodeposition onto Tantalum Diffusion Barrier by Two-Step Deposition Process
Sunjung Kim
ELECTROCHEMICAL AND SOLID STATE LETTERS (2010)
Seedless copper electroplating on Ta from a single electrolytic bath
David Starosvetsky et al.
ELECTROCHIMICA ACTA (2010)
Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration
O. Luehn et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2009)
Filling of microvia with an aspect ratio of 5 by copper electrodeposition
O. Luehn et al.
ELECTROCHIMICA ACTA (2009)
Ionic liquids of bis(alkylethylenediamine)silver(I) salts and the formation of silver(0) nanoparticles from the ionic liquid system
Masayasu Iida et al.
CHEMISTRY-A EUROPEAN JOURNAL (2008)
Through-Hole Filling by Copper Electroplating
Wei-Ping Dow et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2008)
Electrodeposition of Cu on Ta-based layers - I. Electrodeposition on Ta
M. Zheng et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2007)
Air and water stable ionic liquids in physical chemistry
Frank Endres et al.
PHYSICAL CHEMISTRY CHEMICAL PHYSICS (2006)
Application of ionic liquids to the electrodeposition of metals
Andrew P. Abbott et al.
PHYSICAL CHEMISTRY CHEMICAL PHYSICS (2006)
A new strategy for synthesis of novel classes of room-temperature ionic liquids based on complexation reaction of cations
JF Huang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2006)
Immersion/electroless deposition of Cu on Ta
ZC Wang et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2004)
Voltammetric and amperometric analyses of electrochemical nucleation: electrodeposition of copper on nickel and tantalum
SB Emery et al.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY (2004)
Influence of oxide thickness on nucleation and growth of copper on tantalum
A Radisic et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2004)
Ionic liquids: Promising solvents for electrochemistry
F Endres
ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE-INTERNATIONAL JOURNAL OF RESEARCH IN PHYSICAL CHEMISTRY & CHEMICAL PHYSICS (2004)
Share Paper
