Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 157, Issue 12, Pages D609-D613Publisher
ELECTROCHEMICAL SOC INC
DOI: 10.1149/1.3491351
Keywords
-
Funding
- Ministry of Education, Science and Technology [2009-0069746]
Ask authors/readers for more resources
Copper was electrodeposited directly onto a sputter-deposited tungsten diffusion barrier layer in an acidic copper-ammonium-citrate (Cu-NH(3)-Cit) bath. The nucleation characteristic of copper deposits according to applied cathodic potential was investigated. The nucleation mode, nuclei density, and dominant copper species to be preferentially reduced were critically dependent on the applied cathodic potential. Pure instantaneous or progressive nucleation of copper was not observed, but instead, mixed nucleation mechanisms appeared. For low cathodic potentials, the copper deposits, which were reduced mainly from cupric ions, showed consequently a progressive nucleation characteristic despite initial instantaneous nucleation. For large cathodic potentials, the instantaneous nucleation of copper was achieved from the reduction of copper complexes following the early stage of progressive nucleation. The copper nuclei density of 2 x 10(10) cm(-2) calculated for filling the sub-70 nm damascene structures was approached by applying large cathodic potentials. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3491351] All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available