Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 157, Issue 5, Pages H540-H545Publisher
ELECTROCHEMICAL SOC INC
DOI: 10.1149/1.3353822
Keywords
annealing; gold; impurities; microwave devices; plasma CVD; silicon compounds; silicon-on-insulator; substrates
Funding
- EPSRC
- Engineering and Physical Sciences Research Council [EP/D032210/1] Funding Source: researchfish
- EPSRC [EP/D032210/1] Funding Source: UKRI
Ask authors/readers for more resources
The concept of fully encapsulated, semi-insulating silicon (SI-Si) Czochralski silicon on insulator substrates for silicon microwave devices is presented. The experimental results show that, using gold as a compensating deep level impurity in silicon, a resistivity of 180 k cm is achieved in this work. Sufficiently high resistivity substrates for microwave applications are obtained by depositing gold on silicon and annealing for 1 h at 1000 degrees C. Silicon dioxide and silicon nitride are considered as diffusion barriers for use in the new technology. At 1000 degrees C, the diffusivity of gold in plasma-enhanced chemical vapor deposited silicon nitride is similar to 3.7x10(-13) cm(2) s(-1), whereas for silicon dioxide, it is less than 6x10(-14) cm(2) s(-1). These results imply that silicon nitride would be ineffective as a diffusion barrier in the SI-Si technology but that a 600 nm thick buried silicon dioxide might allow devices to be processed with a thermal budget of up to 15 h at 1000 degrees C without impurity contamination.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available