Related references
Note: Only part of the references are listed.Lithium-ion intercalation Behavior of LiFePO4 in aqueous and nonaqueous electrolyte solutions
Ping He et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2008)
Low-temperature bonding of copper pillars for all-copper chip-to-substrate interconnections
Ate He et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2006)
Morphology and bond strength of copper wafer bonding
KN Chen et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2004)
Room temperature Cu-Cu direct bonding using surface activated bonding method
TH Kim et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A (2003)