How to affect number, size, and location of metal particles deposited in conducting polymer layers

This paper presents a review on a series of recent investigations focused on the understanding of the role of various factors for the number, size, and location of the metal particles electrodeposited in conducting polymer (CP) layers. It is demonstrated that the initial oxidation state of the CP layer and its surface and bulk structure play an important role for the location of the metal particles. The use of metal anion complexes instead of the corresponding metal cations presents a helpful tool for affecting the location and number of metal crystals. The involvement of special metal/polymer interactions in the metal electrocrystallization process is another way for influencing the metal deposit. An alternative to the electrodriven deposition is the electroless metal precipitation based on the reducing ability of the CP layers. This approach results in metal particles deposition at the polymer surface and may be effectively controlled through parameters such as CP reduction charge, dipping time, and concentration of the metal-plating solution.