Journal
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 120, Issue 4, Pages 1275-1281Publisher
SPRINGER
DOI: 10.1007/s00339-015-9373-z
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Funding
- Agency for Science, Technology and Research (A*STAR), Singapore
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We investigate the thermal conductivity of interlayer-bonded bilayer graphene, trilayer graphene, and pyrolytic graphite using molecular dynamics simulations. We find that interlayer sp(3) bonding greatly reduces the thermal conductivity, with the reduction up to 80 %, depending on the distribution and coverage of sp(3) bonds. Besides, we find that tensile strain reduces the thermal conductivity of interlayer-bonded graphene further by up to 50 %. Our findings suggest the possibility of using interlayer sp(3) bonds and tensile strain to tune and manipulate the thermal conductivity of multi-layer graphene, which may be useful in thermal management of graphene-based nanodevices and in thermoelectric applications of graphene.
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