Journal
JOURNAL OF PHYSICS D-APPLIED PHYSICS
Volume 41, Issue 9, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0022-3727/41/9/094002
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Funding
- EPSRC [EP/F05999X/1, EP/D078555/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/F05999X/1, EP/D078555/1] Funding Source: researchfish
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Flip-chip InGaN micro-pixellated LED arrays with high pixel density and improved device performance are presented. The devices, with 64 x 64 elements, each of which have a 20 mu m emission aperture on a 50 mu m pitch, are fabricated with a matrix-addressable scheme at blue ( 470 nm) and UV ( 370 nm) wavelengths, respectively. These devices are then flip-chip bonded onto silicon mounts. Good emission uniformity across the LED array is demonstrated, which can be attributed to the introduced n-metal tracks adjacent to each n-GaN mesa and the p-contact lines running across parallel columns. More importantly, with a flip-chip configuration, the optical power output and the current-handling capability of these new devices are substantially enhanced, due to the improved heat dissipation capability and the increased light extraction efficiency. For instance, each pixel in the flip-chip blue ( respectively UV) LED arrays can provide a maximum power density 43 W cm(-2) ( respectively 6.5 W cm(-2)) at an extremely high current density up to 4000 A cm(-2) before breakdown. These flip-chip devices are then combined with a computer-programmable driver circuit interface to produce high-quality micro-scale displays. Other promising applications of these LEDs, such as colour conversion with quantum dots, are also demonstrated.
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