Journal
JOURNAL OF PHYSICS D-APPLIED PHYSICS
Volume 41, Issue 19, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0022-3727/41/19/195404
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Funding
- National Basic Research Program of China [2004CB619303]
- National Natural Science Foundation
- National Outstanding Young Investigator Grant of China
- 111 Project of China [B06025]
- Ministry of Education of China [02182, 03182]
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For polymer-supported metal thin films used in flexible electronics, the definition of the fatigue lifetime at microcrack nucleation (FLMN) should be more physically meaningful than all the previous definitions at structural instability. In this paper, the FLMN of Cu films (with thickness from 100 nm to 3.75 mu m) as well as Al thin films (from 80 to 800 nm) was experimentally characterized at different strain ranges and different thicknesses by using a simple electrical resistance measurement (ERM). A significant thickness dependence was revealed for the FLMN and a similar Coffin-Manson fatigue relationship observed commonly in bulk materials was found to be still operative in both the films. Microstructural analyses were carried out to verify the feasibility of ERM correspondingly.
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