Journal
JOURNAL OF PHYSICAL CHEMISTRY C
Volume 114, Issue 32, Pages 13614-13619Publisher
AMER CHEMICAL SOC
DOI: 10.1021/jp105182y
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Funding
- Fundamental Research Funds for the Central Universities [2009QNA4006]
- Research Foundation of Education Bureau of Zhejiang Provinc [Y200906938]
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Nanoporous Ag films on copper alloy substrates were fabricated by the galvanic replacement reaction from the choline chloride-based deep eutectic solvents (DES) containing AgCl. It was found that the morphologies of the films were largely dependent on AgCl concentrations and plating temperatures. Interestingly, self-assembled nanoporous network of Ag films with ligament and channel width in the range of 20-80 nm was formed on the copper alloy substrate from 0.01 M AgCl DES solution either at room temperature or at 50 degrees C. The as-deposited porous Ag films exhibited hydrophilic properties. On the contrary, after surface modification by a monolayer of n-dodecanethiol, the contact angle of porous Ag film increased largely with plating times, and a superhydrophobic surface was finally obtained with a contact angle of 160 +/- 1 degrees. Wenzel and Cassie-Baxter models were used to qualitatively illustrate the importance of the surface roughness of the Ag films to the wetting property.
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