4.3 Article

Use of permanent marker to deposit a protection layer against FIB damage in TEM specimen preparation

Related references

Note: Only part of the references are listed.
Article Materials Science, Multidisciplinary

A Method for Producing Site-Specific TEM Specimens from Low Contrast Materials with Nanometer Precision

Henrik Pettersson et al.

MICROSCOPY AND MICROANALYSIS (2013)

Article Microscopy

Minimizing damage during FIB sample preparation of soft materials

N. D. Bassim et al.

JOURNAL OF MICROSCOPY (2012)

Article Microscopy

Sample preparation for atomic-resolution STEM at low voltages by FIB

Miroslava Schaffer et al.

ULTRAMICROSCOPY (2012)

Article Physics, Multidisciplinary

Hydrodynamics of Writing with Ink

Jungchul Kim et al.

PHYSICAL REVIEW LETTERS (2011)

Article Engineering, Electrical & Electronic

Transmission electron microscopy study of damage layer formed through ion beam induced deposition of platinum on silicon substrate

Byong Chon Park et al.

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2010)

Article Microscopy

Quantitative HRTEM analysis of FIB prepared specimens

M. Baram et al.

JOURNAL OF MICROSCOPY (2008)

Article Anatomy & Morphology

Evaluation of top, angle, and side cleaned FIB samples for TEM analysis

Eduardo Montoya et al.

MICROSCOPY RESEARCH AND TECHNIQUE (2007)

Article Materials Science, Multidisciplinary

Focused ion beam microscopy and micromachining

C. A. Volkert et al.

MRS BULLETIN (2007)

Article Microscopy

FIB-induced damage in silicon

S Rubanov et al.

JOURNAL OF MICROSCOPY (2004)

Review Microscopy

Reducing focused ion beam damage to transmission electron microscopy samples

NI Kato

JOURNAL OF ELECTRON MICROSCOPY (2004)

Article Engineering, Electrical & Electronic

Comparative evaluation of protective coatings and focused ion beam chemical vapor deposition processes

BW Kempshall et al.

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2002)

Article Engineering, Electrical & Electronic

A review of focused ion beam applications in microsystem technology

S Reyntjens et al.

JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2001)