Arrays of hollow out-of-plane microneedles made by metal electrodeposition onto solvent cast conductive polymer structures

Transdermal drug delivery using microneedles is a technique to potentially replace hypodermic needles for injection of many vaccines and drugs. Fabrication of hollow metallic microneedles so far has been associated with time-consuming steps that restrict batch production of these devices. Here, we are presenting a novel method for making metallic microneedles with any desired height, spacing, and lumen size. In our process, we use solvent casting to coat a mold, which contains an array of pillars, with a conductive polymer composite layer. The conductive layer is then used as a seed layer in a metal electrodeposition process. To characterize the process, the conductivity of the polymer composite with respect to different filler concentrations was investigated. In addition, plasma etching of the polymer was characterized. The electroplating process was also studied further to control the thickness of the microneedle array plate. The strength of the microneedle devices was evaluated through a series of compression tests, while their performance for transdermal drug delivery was tested by injection of 2.28 mu m fluorescent microspheres into animal skin. The fabricated metallic microneedles seem appropriate for subcutaneous delivery of drugs and microspheres.