Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 19, Issue 6, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/19/6/067001
Keywords
-
Categories
Funding
- Flemish government [GOA ZKB2156]
- Power MEMS programs
- Flemish government [GOA ZKB2156]
- Power MEMS programs
Ask authors/readers for more resources
This note presents a simple, low-cost technology to fabricate very deep isotropically etched features in glass wafers. A process based on fast etching glass combined with a stress-optimized molybdenum mask layer and a photoresist was found to be very suitable for such purposes. The obtained performance, up to 1.2 mm deep etching, rivals the best existing techniques while being more cost-competitive and using widely available equipment.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available