4.4 Article

Microwave-induced, thermally assisted solvent bonding for low-cost PMMA microfluidic devices

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IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/20/1/015026

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  1. NSERC
  2. Shastri Indo-Canadian Foundation
  3. Wighton Foundation

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We present a low-cost bonding method for polymethylmethacrylate (PMMA) microfluidics that combines elements of solvent bonding, thermal bonding and microwave bonding. Rather than using specialized equipment, we take household equipment and combine it to produce an effective bonding method that borrows from food packaging technologies for selective heating in a microwave. A poor solvent for PMMA is applied between two halves of a microfluidic system and clamped together using miniature binder clips. Excess solvent from the channels is then drawn out via capillary action and avoids channel clogging during the bonding process. Placing the whole apparatus in a commercial microwave will heat up the thin metal clips and cause the solvent to dissolve and bond the PMMA interface. The whole bonding process takes only a few minutes, and results in high bond strengths.

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