Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 23, Issue 2, Pages 417-423Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2013.2279017
Keywords
Acoustic; MEMS; Sound sensor; capacitive readout
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Funding
- National Consortium for MASINT Research
- U.S. Navy Space and Naval Warfare Systems Command Fellowship
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We present an enhanced in-plane capacitive readout for sensing out-of-plane displacement in a MEMS acoustic sensor. The sensor is fabricated in a multi-user silicon-on-insulator process, using a thicker device layer to reduce misalignment between moving and fixed comb fingers. This misalignment is found to reduce the sensitivity and render the response nonlinear. In addition, incorporation of a branched comb design doubles the readout capacitor surface area for a given sensor size, to further increase the sensitivity. These two modifications restore linearity to the readout and increase its sensitivity to displacement by an order of magnitude. [2013-0191]
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