4.5 Article

Multi-Height Precision Alignment With Selectively Developed Alignment Marks

Journal

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 23, Issue 2, Pages 424-437

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2013.2279231

Keywords

Microfabrication; microelectromechanical systems; microfluidics; lithography; alignment

Funding

  1. NSF MRSEC [DMR-0820492]
  2. Pioneer Research Center Program through the National Research Foundation of Korea [2013-005772]

Ask authors/readers for more resources

The alignment step in fabricating multi-height photoresist masters is a critical and time-consuming process. SU8 masters that combine very thin and thick layers can be difficult to align because of low contrast visibility. We increase visual contrast by selectively developing alignment marks to ease fabrication of masters with thick resist layers deposited on much thinner ones. In addition, we use a vernier calliper based alignment mark to achieve high precision alignment. [2013-0172]

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