4.5 Article

A Ku-band Dual-SPDT RF-MEMS Switch by Double-Side SOI Bulk Micromachining

Journal

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 20, Issue 5, Pages 1211-1221

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2011.2162490

Keywords

Bulk micromachining; deep reactive-ion etching (DRIE); dual single-pole double-throw (dual-SPDT); gold electroplating; ohmic contact; radio-frequency microelectromechanical systems (RF-MEMS) switch; X-Ku-band

Funding

  1. Radio-wave Research and Development for Prospect of Radio Wave Usage in the Medium and Long Term Foundation
  2. Grants-in-Aid for Scientific Research [10J07437] Funding Source: KAKEN

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This paper presents the design, fabrication method, and measurement results of a low-loss ohmic-contact radio-frequency microelectromechanical systems (MEMS) switch. A novel bidirectional electrostatic actuation mechanism has been developed for a dual single-pole double-throw switch that could be used for an X-Ku-band low-temperature cofired ceramic switched-line-type phase shifter. A high-aspect-ratio deep reactiveion etching process and a thick gold-plating process were used to develop low-insertion-loss air-suspended MEMS waveguides and low resistive ohmic contacts. A typical insertion loss of 0.56 dB, a return loss of 19.4 dB, and an isolation of 51.4 dB were obtained at a Ku-band frequency of 12 GHz. [2010-0364]

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