Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 20, Issue 1, Pages 28-36Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2010.2090495
Keywords
Bulk metallic glass (BMG); gyroscopes; microelectromechanical systems (MEMS) devices; packaging; resonators; 3-D microshells
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Funding
- National Science Foundation [0826445]
- U.S. Army Phase II Small Business Innovation Research [W15QKN-09-C-0067]
- Directorate For Engineering
- Div Of Civil, Mechanical, & Manufact Inn [0826445] Funding Source: National Science Foundation
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A blow molding method based on thermoplastic forming of bulk metallic glasses (BMGs) is used to fabricate 3-D microshells. The 3-D microshells are attached to the Si wafer through mechanical locking, which is achieved in the same processing step. Versatile sizes and shapes of the 3-D shells can be precisely controlled. High strength (> 1 GPa), elasticity (similar to 2%), and controlled surface roughness (< 2 nm), which are achievable for BMGs, suggest their potential use in devices, including resonators, microlenses, microfluidic, and packaging.
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