Related references
Note: Only part of the references are listed.Fracture Properties of LPCVD Silicon Nitride and Thermally Grown Silicon Oxide Thin Films From the Load-Deflection of Long Si3N4 and SiO2/Si3N4 Diaphragms
Jinling Yang et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2008)
A micro-tensile method for measuring mechanical properties of MEMS materials
Rui Liu et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2008)
Seamless interpretation of the strength and fatigue lifetime of polycrystalline silicon thin films
Shoji Kamiya et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2008)
Micro- and nanomechanical structures for silicon carbide MEMS and NEMS
Christian A. Zorman et al.
PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS (2008)
Tensile and high cycle fatigue test of Al-3% Ti thin films
Jun-Hyub Park et al.
SENSORS AND ACTUATORS A-PHYSICAL (2008)
Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS
Ming-Tzer Lin et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2008)
A new micro-tensile system for measuring the mechanical properties of low-dimensional materials - Fibers and films
Tao Hua et al.
POLYMER TESTING (2007)
Advanced silicon microstructures, sensors, and systems
Oliver Paul et al.
IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING (2007)
Process temperature-dependent mechanical properties of polysilicon measured using a novel tensile test structure
Shoji Kamiya et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2007)
Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system
Ming-Tzer Lin et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2006)
Development of AFM tensile test technique for evaluating mechanical properties of sub-micron thick DLC films
Y Isono et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2006)
Nanoscale Weibull statistics
NM Pugno et al.
JOURNAL OF APPLIED PHYSICS (2006)
Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films
T Tsuchiya et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2005)
Fracture strength of silicon carbide microspecimens
WN Sharpe et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2005)
Electrostatic microresonators from doped hydrogenated amorphous and nanocrystalline silicon thin films
J Gaspar et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2005)
Electrostatically actuated polymer microresonators
G Zhang et al.
APPLIED PHYSICS LETTERS (2005)
Out of plane vs. in plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach
F Cacchione et al.
MICROELECTRONICS RELIABILITY (2005)
Micromachined force sensors for the study of cell mechanics
S Yang et al.
REVIEW OF SCIENTIFIC INSTRUMENTS (2005)
Wafer-level mechanical characterization of silicon nitride MEMS
A Kaushik et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2005)
Anisotropy in fracture of single crystal silicon film characterized under uniaxial tensile condition
XP Li et al.
SENSORS AND ACTUATORS A-PHYSICAL (2005)
Amorphous silicon electrostatic microresonators with high quality factors
J Gaspar et al.
APPLIED PHYSICS LETTERS (2004)
Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials
OM Jadaan et al.
JOURNAL OF MATERIALS SCIENCE (2003)
Microsample tensile testing of nanocrystalline copper
YM Wang et al.
SCRIPTA MATERIALIA (2003)
Etch rates for micromachining processing - Part II
KR Williams et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2003)
Application of Fourier analysis to the laser based interferometric strain/displacement gage
M Zupan et al.
EXPERIMENTAL MECHANICS (2002)
Polysilicon: a versatile material for microsystems
PJ French
SENSORS AND ACTUATORS A-PHYSICAL (2002)
Application of MEMS force sensors for in situ mechanical characterization of nano-scale thin films in SEM and TEM
MA Haque et al.
SENSORS AND ACTUATORS A-PHYSICAL (2002)
In-situ tensile testing of nano-scale specimens in SEM and TEM
MA Haque et al.
EXPERIMENTAL MECHANICS (2002)
A methodology and model for the pull-in parameters of electrostatic actuators
Y Nemirovsky et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2001)
Fatigue in thin films: lifetime and damage formation
O Kraft et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2001)
Tensile properties of free-standing aluminum thin films
DT Read et al.
SCRIPTA MATERIALIA (2001)
Amorphous and microcrystalline silicon deposited by hot-wire chemical vapor deposition at low substrate temperatures: application to devices and thin-film microelectromechanical systems
JP Conde et al.
THIN SOLID FILMS (2001)
Effect of specimen size on Young's modulus and fracture strength of polysilicon
WN Sharpe et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2001)
Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
HB Huang et al.
ACTA MATERIALIA (2000)
Substrate curvature due to thin film mismatch strain in the nonlinear deformation range
LB Freund
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2000)
Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength
TC Yi et al.
SENSORS AND ACTUATORS A-PHYSICAL (2000)
Tensile testing of insulating thin films;: humidity effect on tensile strength of SiO2 films
T Tsuchiya et al.
SENSORS AND ACTUATORS A-PHYSICAL (2000)
Share Paper
