Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 18, Issue 6, Pages 1318-1325Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2009.2030956
Keywords
Bonding; fabrication; microelectromechanical devices; packaging
Categories
Funding
- Swedish Intelligent Vehicle Safety Systems program
- Autoliv Development AB
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In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of micro-cavities using a room-temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs including their impact on the resulting bond quality. The sealing properties against liquids and vapor of different sealing ring structures have been evaluated for glass wafers that are bonded to silicon wafers. In addition, wafer-level vacuum sealing of microcavities was demonstrated when bonding a silicon wafer to another silicon wafer with the proposed room-temperature sealing and bonding technique.
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