Fabrication and characterization of a wafer-level MEMS vacuum package with vertical feedthroughs

This paper reports a MEMS vacuum package with vertical feedthroughs formed in a glass substrate all at the wafer level. This approach satisfies requirements for MEMS vacuum packages, including small size, vacuum/hermetic capability, sealed and low parasitic feedthroughs, wafer-level processing, compatibility with most MEMS processes, and low cost. It also enables flip-chip solder attachment to a PC board. The package has an integrated micro-Pirani gauge on a glass substrate for in situ monitoring, a silicon cap, and vertical feedthroughs through the glass. The integrated Pirani gauge has 0.6 milli-torr resolution at 0.1 torr and 0.2 torr resolution at 100 torr. Using the Pirani gauge, the fabricated vacuum package is characterized. The package has maintained similar to 33 torr base pressure with +/- 1.5 torr uncertainty for more than four months without a getter. The long-term measured pressure uncertainty is from the measurement setup and environment, and can be improved using a getter inside the package.