Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 29, Issue 20, Pages 17201-17208Publisher
SPRINGER
DOI: 10.1007/s10854-018-9812-7
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Funding
- UGC, India [4-1/2010 (BSR)]
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Copper bismuth sulfide thin films were deposited at 200 A degrees C, 300 A degrees C, 400 A degrees C and 500 A degrees C on the glass substrates by electron beam evaporation method. X-ray diffraction study revealed that the copper bismuth sulfide films of single and mixed phases were formed as a function of substrate temperatures. Substrate temperature of 300 A degrees C and 400 A degrees C formed single phase Cu4Bi4S9 and Cu4Bi5S10 films respectively whereas substrate temperature of 500 A degrees C formed mixed phases of Cu4Bi4S9 and Cu4Bi5S10 film. Crystallite size, dislocation density and microstrain of the films were modified by the various substrate temperatures. Surface morphology of the film Cu4Bi5S10 deposited at 400 A degrees C examined by scanning electron microscopy showed the distribution of spherical shaped particles on the film surface. The presence of copper, bismuth and sulfur elements in the deposited films was confirmed using energy dispersive spectral studies. The calculated direct optical band gap energy of the films deposited at different substrate temperature varied from 1.47 to 1.64 eV and the absorption coefficient is in the order of 10(6) cm(-1).
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