Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 21, Issue 1, Pages 1-15Publisher
SPRINGER
DOI: 10.1007/s10854-009-0014-1
Keywords
-
Categories
Funding
- Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan [CX09B_074Z]
- Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing foundation [BCXJ09-07]
- Six Kind Skilled Personnel Project of Jiangsu Province [06-E-020]
Ask authors/readers for more resources
Sn-Zn solder alloys have been considered as one of the more attractive lead-free solders since it can easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. However, there are still some problems to be resolved, such as the argument about the poor oxidation resistance and embrittlement behavior. In order to overcome these drawbacks, and further enhance the properties of Sn-Zn lead-free solder alloys, a small amount of alloying elements (rare earths, Bi, Ag, Al, Ga, In, Cr, Cu, Sb, Ni, Ge) added into Sn-Zn alloys were selected by many researchers. For example, a small amount of Al, P, Bi, Ga can improve the high-temperature oxidation resistance of Sn-Zn solders remarkably as well as Cr. This paper summarizes the effects of alloying elements on the wettability, oxidation resistance, melting behavior, mechanical properties, creep properties, microstructures and intermetallic compounds layer of Sn-Zn lead-free solders.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available