Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 28, Issue 7, Pages 661-665Publisher
JOURNAL MATER SCI TECHNOL
DOI: 10.1016/S1005-0302(12)60113-3
Keywords
Sn3.0Ag0.5Cu; Diamond; Composite solder; Chemical plating
Funding
- Scientific and Technological Development Projects in Shandong Province [2010GGX10307]
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Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260 degrees C for 60 s. The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized. When diamond additions were below 3 wt%, the spreading area decreased with diamond additions, and the diamonds distributed mainly at the interface between solder and Cu pad; however, when additions were beyond 4 wt%, the discharge of diamond particle occurred, and the spreading area increased due to the reduction of surface energy.
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