Related references
Note: Only part of the references are listed.Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure
S. P. Peng et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2010)
Formation of intermetallic compounds between liquid Sn and various CuNix metallizations
V. Vuorinen et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
S. C. Yang et al.
JOURNAL OF MATERIALS RESEARCH (2006)
Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples
Chin-yi Chou et al.
JOURNAL OF MATERIALS RESEARCH (2006)
Interfacial reactions between lead-free solders and common base materials
T Laurila et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2005)
Thermodynamic optimization of the Ni-Sn binary system
HS Liu et al.
CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (2004)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K Zeng et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2002)
Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
CE Ho et al.
JOURNAL OF ELECTRONIC MATERIALS (2000)