Journal
JOURNAL OF MATERIALS RESEARCH
Volume 25, Issue 2, Pages 303-314Publisher
CAMBRIDGE UNIV PRESS
DOI: 10.1557/JMR.2010.0035
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Funding
- National Basic Research Program of China [2010CB631006]
- National Outstanding Young Scientist Foundation [50625103]
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To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu-X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu-X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu-X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu-X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn-Bi solder widely used in the electronic interconnection in the future.
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